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Thermal Analysis
Let Enerdyne optimize an analysis method to achieve your program’s specific objectives, budget, and schedule.
Approaches range from proof-of-concept calculations to complex multiphysics simulations and Finite Element Analysis (FEA).
Multiphysics modeling allows Enerdyne to analyze the impact of a candidate thermal solution on other design constraints
such as electromagnetic interference or thermomechanical stresses and strains.
Enerdyne is experienced with modeling systems for the semiconductor, electronics and medical device industries as well as military and space applications.
Capabilities include:
- Axisymmetrical, 2D and 3D Multiphysics modeling including Computational Fluid Dynamics (CFD)
- Multiple Finite Element Analysis (FEA) applications including COMSOL, FlexPDE and FEMM
- Thermal Network Flow Analysis
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